[FEATURES]

• MEMS application, R&D

• 4~12inch wafer manual loading

• High voltage : 100~1000VDC

• High vacuum : < 5x10-6 Torr 

               (Rotary + Turbo pump)

- 상온, 1시간 pumping

- Turbo pump ultimate pressure

         : 7.5x10-8 Torr

• High pressure : upto 8,000N

• High Temperature : process at ~370℃

• Self flatness alignment 

  ; prevent wafer damage

• 전원 : 단상, 210VAC±10%, 50/60Hz, 4KVA